HL-S134X85

HL-S134X85 is a low-molecular-weight, solvent-based epoxy resin of bisphenol-A type, containing 15% xylene. When used in combination with a curing agent, it offers excellent chemical resistance, impact strength, and adhesion, making it suitable for anti-corrosion coatings.

HL-P638

HL-P638 is a phenolic epoxy resin of the phenol type. The phenol backbone provides thermal resistance, while the epoxy groups offer reactivity. Compared to bisphenol-A-type epoxy resins, HL-P638 exhibits higher thermal resistance, chemical resistance, and adhesion after curing. It is widely used in electronic materials, composite materials, civil engineering, and other fields.

HL-L134

HL-L134 is a low-molecular-weight epoxy resin of bisphenol-A type, which, when used in combination with a curing agent, offers excellent chemical resistance, impact strength, and adhesion, making it suitable for anti-corrosion coatings.

HL-S601

HL-S601 is a modified solid epoxy resin with a low molecular weight and a high glass transition temperature, which can improve the gelation rate of low-molecular-weight solid epoxy resins. It exhibits excellent solubility in solvents and, after crosslinking and curing with polyamides, demonstrates outstanding physical properties. It is widely used in coatings, composite materials, and other applications.

HL-S602

HL-S602 is a modified solid epoxy resin with a medium molecular weight, characterized by high fluidity and excellent leveling properties. It is particularly well-suited for use in powder coatings. In addition, HL-S602 can be blended with other epoxy resins to adjust the performance of the formulation.

HL-S605

HL-S605 is a modified solid epoxy resin with a medium molecular weight. When used in combination with a curing agent and fillers, it offers excellent corrosion resistance and chemical resistance, making it particularly well-suited for powder coatings.

HL-S607

HL-S607 is a modified high-molecular-weight solid epoxy resin that offers excellent chemical resistance, flexibility, adhesion, and abrasion resistance. It is widely used in can coatings and coil coatings, among other applications.

HL-S609

HL-S609 is a modified high-molecular-weight solid epoxy resin that offers excellent chemical resistance, flexibility, adhesion, and abrasion resistance. It is widely used in applications such as can coatings and coil coatings.

HL-S901

HL-S901 is a low-molecular-weight solid epoxy resin of bisphenol-A type, featuring high cross-linking density, strong adhesion, and excellent water resistance. It is suitable for use in anti-corrosion coatings and substrate boards, among other applications.

HL-S901X75

HL-S901X75 is a low-molecular-weight, solvent-based epoxy resin of bisphenol-A type. It is a 75% solids epoxy resin solution obtained by dissolving HL-S901 in xylene for dilution. After curing, it exhibits excellent chemical resistance and superior physical properties, making it widely used in applications requiring high corrosion resistance, such as anti-corrosion coatings.

HL-S902

HL-S902 is a bisphenol-A-type solid epoxy resin with medium-to-low molecular weight, featuring high crosslink density, strong adhesion, and excellent water resistance. It is widely used in powder coating applications.

HL-S903

HL-S903 is a bisphenol-A-type solid epoxy resin with a medium-to-low molecular weight, featuring excellent physical properties and chemical stability. Thanks to its outstanding high-gloss and leveling performance, it is widely used in powder coatings.