HL-A640

HL-A640 is a standard polyamide resin with a high imidazoline content, featuring room-temperature curing properties, flexibility, low toxicity, and excellent water resistance. It is widely used in high-solids coatings, adhesives, and sealing materials.

HL-A5022

HL-A5022 is a standard high-viscosity polyamide resin featuring room-temperature curing properties, flexibility, low toxicity, and excellent water resistance. It exhibits good compatibility with epoxy resins, has a long pot life, and is widely used in coatings, adhesives, and other applications.

HL-A5022X70

HL-A5022X70 is a solvent-based polyamide resin obtained by dissolving HL-A5022 in xylene. It features room-temperature curing properties, flexibility, low toxicity, and excellent water resistance. It exhibits good compatibility with epoxy resins, has a long pot life, and is particularly well-suited for use as a solvent-based primer.

HL-B400

HL-B400 is a high-bromine-content epoxy resin synthesized by reacting tetrabromobisphenol A with ECH, with a bromine content ranging from 46% to 50%. Due to the presence of the flame-retardant element bromine in its molecular structure, brominated epoxy resins can be used as flame retardants and are commonly employed in printed circuit boards.

HL-B450A80

HL-B450A80 is a brominated bisphenol-A-type epoxy resin (white glue) containing approximately 20% acetone. When used in combination with a DICY curing agent, this resin can serve as a raw material for the production of copper-clad laminates. It can also be applied as a surface coating to provide flame-retardant protection.

HL-B454A80

HL-B454A80 is a brominated bisphenol-A-type epoxy resin (yellow glue) containing approximately 20% acetone. This resin exhibits excellent flame retardancy and electrical insulation properties. When used in combination with curing agents and accelerators, it can serve as a raw material for the production of copper-clad laminates and provides UV shielding functionality. It can also be used for surface coatings to offer flame-retardant protection.

HL-C704

HL-C704 is a meta-cresol-based phenolic epoxy resin that is similar to phenol-based phenolic epoxy resins. It uses meta-cresol in place of phenol. Due to the presence of a methyl group at the ortho position, it exhibits superior stereoselectivity during synthesis compared to phenol-based resins, enabling the formation of high-molecular-weight polymers with long, linear chain structures. HL-C704 can be used in combination with polyamines, anhydrides, phenolic resins, and other materials. After curing, it features a high glass transition temperature (Tg), excellent thermal stability, and outstanding chemical resistance, making it widely applicable as a substrate for printed circuit boards and in composite materials.

HL-L170

HL-L170 is a bisphenol-F-based standard-grade epoxy resin that has lower viscosity than bisphenol-A-based epoxy resins. It also boasts excellent flexibility and adhesion, making it widely used in solvent-free coatings, electrical insulation materials, the construction industry, and other applications.

HL-L127

HL-L127 is a low-viscosity liquid epoxy resin based on bisphenol A, featuring excellent mechanical strength, chemical resistance, and heat resistance. It is widely used in encapsulating materials, multilayer printed circuit boards, civil engineering substrates, coatings, adhesives, composite materials, and more.

HL-L127E

HL-L127E is a bisphenol-A-type liquid epoxy resin for electronic applications. It has a lower viscosity than HL-L128 and boasts excellent mechanical strength, chemical resistance, and thermal stability. It is widely used in coatings, electronic materials, composite materials, and more. Due to its low hydrolytic chlorine content, it is particularly well-suited for electronic products.

HL-L128

HL-L128 is a bisphenol-A-based standard liquid epoxy resin with excellent mechanical strength, chemical resistance, and heat resistance. It is widely used in coatings, electronic materials, composite materials, and more.

HL-L128E

HL-L128E is a bisphenol-A-type liquid epoxy resin for electronic applications, featuring excellent mechanical strength, chemical resistance, and thermal stability. It is widely used in coatings, electronic materials, composite materials, and more. Due to its low hydrolyzable chlorine content, it is particularly well-suited for electronic products.